HapticSystem
Architecture diagram of the sensing–computing–control (all-in-one) haptic co-processor

2026

[To be confirmed: what this figure refers to, e.g. founding year / team size]

Company Profile

Making robots more sensitive, stable and safe when they touch the world

HapticSystem Technology (Guangzhou) Co., Ltd. is a startup in embodied haptic intelligence and edge co-processing chips, incubated at The Hong Kong University of Science and Technology (Guangzhou). We are dedicated to developing a purpose-built AI chip for haptic edge co-processing based on a sensing–computing–control (all-in-one) architecture, and we provide a complete "chip + toolchain + dataset" solution for robotics, medical wearables, XR haptic interaction and other scenarios — building an open innovation platform for the shared technologies that bring haptic intelligence to industry.

  • Built on the team's long-standing experience in sensor signal processing, AI chip design and mass production
  • Connecting tactile sensors and robot end effectors with the robot's "main brain" that handles overall decision-making
  • Continuously improving the product through real robot tasks to build a haptic technology platform that keeps evolving

Our Approach

Starting from real robot needs to build haptics

As robots move step by step into factories, homes and public services, being able to "see" is no longer enough. They also need to sense force, slip and collision when they touch objects, so that they can perform more delicate and safer operations. HapticSystem focuses precisely on the tactile sensing needs of robots, developing embodied haptic edge co-processing chips together with the supporting hardware and software platform.

Our Mission

Helping robots understand touch in time. When a robot grasps a cup, a piece of fruit or a soft object, the system processes contact, force and slip information right nearby, helping the robot judge "is it holding it", "is the force right" and "is the object slipping", and giving it a basis for adjusting its next move.

Our Vision

Building a haptic technology platform that keeps evolving. We develop not only the chip but also the supporting software tools, algorithm models and reference designs, and we keep improving the product through real robot tasks, so that it adapts to different needs such as delicate grasping, industrial operations and safe human–robot interaction.

Concept diagram of the closed-loop haptic technology
Concept image of a tactile sensing product

Technology Directions

In the haptics-specific edge computing white space

The project offers systematic innovation in an untapped upstream field — "haptics-specific edge computing architecture + neuromorphic compute-in-memory chip" — aiming to break the three key bottlenecks of embodied intelligence today: the separation of sensing, computing and control; the conflict between computing power and power consumption; and the difficulty of feeding tactile data to models effectively.

  • First-of-its-kind sensing–computing–control (all-in-one) co-processing architecture dedicated to haptics
  • A neuromorphic compute-in-memory (CIM) chip as the foundation, pushing on-device energy efficiency to its limit
  • A full-stack ecosystem built on "chip + data + standards + toolchain"
HapticSystem at work

Ways to Partner

Working together to bring haptic capability into real products

We are open to partnership with different kinds of partners; from technology integration to joint projects, it can all start with one concrete technical conversation.

  • Business partnership: robot OEMs, sensor makers and end application providers
  • Technology partnership: teams that need to integrate a haptic solution
  • Research collaboration: universities, research institutes and joint projects

Milestones and Endorsements

Step-by-step technical progress

Founded and incubated at The Hong Kong University of Science and Technology (Guangzhou), focused on embodied haptic intelligence and edge co-processing chips.

Company Founded

HapticSystem Technology (Guangzhou) Co., Ltd.

Our technology direction and innovations were covered by Xinhua News Agency, described as adding a haptic "cerebellum" to robots and helping them understand in time what changes when they touch an object.

Xinhua News Agency Coverage

Feature on the technical breakthroughs and innovations

The project was selected for the "invest-first, convert-later" program after review, and the related technical breakthroughs and innovations were submitted as supplementary materials and recognized.

Project Selected

The "invest-first, convert-later" program

Related chip and processor research results were published at VLSI 2025 and ISSCC 2026, international conferences in the integrated circuit field.

Academic Results

VLSI 2025 / ISSCC 2026

Exhibited at the INNOTECH Innovation and Technology Carnival and signed the project agreement, continuing to expand industry and capital partnerships.

Industry Event

INNOTECH Innovation and Technology Carnival

About the Company

A few things you may want to know

If you would like to know more about our technology roadmap, team background or ways to partner, feel free to get in touch.

We focus on the tactile sensing needs of robots, developing embodied haptic edge co-processing chips and the supporting hardware and software platform — that is, a purpose-built AI chip for haptic edge co-processing based on a sensing–computing–control (all-in-one) architecture, together with a software toolchain and datasets.

The technology helps a robot understand in time what changes when it touches an object, and passes the useful information to the robot's "main brain" that handles overall decision-making. By analogy with the human body, it plays the role of the cerebellum — processing haptic information locally and quickly — while leaving overall decisions to the main brain.

It builds on the team's long-standing experience in sensor signal processing, AI chip design and mass production. [To be confirmed: team background] — if you want to publish members' education, positions and achievements, please provide information confirmed by the individuals themselves.

The company is located in Guangzhou and was incubated at The Hong Kong University of Science and Technology (Guangzhou). Full address: Room 2101-25, Technology Building, Guangzhou Nansha Information Technology Park, No. 2 Huanshi Avenue South, Nansha District, Guangzhou.

We are open to business partnership, technology partnership and research collaboration. You can submit an enquiry through the Contact page, or email us at info@hapticsys.com, and we will put you in touch with the right colleague.