HapticSystem

Flexible Tactile Sensing Module

Acquires heterogeneous tactile signals such as pressure, force, temperature, vibration, slip and flexible electronic skin, giving robots reliable contact-sensing input.

On-Device Haptic Co-Processing Chip

A purpose-built haptic co-processing architecture with a sensing–computing–control (all-in-one) design, integrating sensing fusion, physical cognition computing and end-effector feedback control into a single on-device chip.

Neuromorphic Compute-in-Memory Processor

A fused architecture of charge-domain compute-in-memory (CIM) and spiking neural networks (SNN) that tackles the high power consumption and high latency of on-device haptic processing at the circuit level.

Software Toolchain & Datasets

A software toolchain supporting automatic TFLite / ONNX deployment, together with our in-house data acquisition system and multimodal haptic data system.

TouchBench Benchmarking Suite

A tactile benchmarking suite for embodied haptic tasks, so that the performance of different haptic solutions can be compared fairly and reproducibly.

Scenario Solutions

Solutions and engineering support for dexterous hands and humanoid robots, collaborative robots and smart manufacturing, medical wearables, and XR haptic interaction.

Technology Path

A haptic closed loop from flexible sensing to robotic applications

HapticSystem builds a complete haptic technology chain from flexible sensing and signal processing to application feedback, so that tactile signals can truly be called upon effectively by robot models.

10+

[To be confirmed: basis of these figures]

HapticSystem at work

How We Work

Technology Highlights

How tactile signals are called upon effectively

Tactile signals are high-frequency, strongly time-ordered and contain the whole contact process; simply layering them onto a vision model can actually degrade system performance. HapticSystem gives touch its own dedicated high-frequency processing path, which is the key difference from comparable tactile sensor solutions.

  • Sensing–computing–control (all-in-one): sensing, computing and control folded into a single on-device chip
  • Charge-domain compute-in-memory fused with spiking neural networks, breaking through the on-device energy-efficiency bottleneck
  • On-chip learning lets the chip adapt locally without relying on the cloud
  • Dual ANN / SNN cores give touch a dedicated high-frequency processing path
  • An upgrade from a single hardware point to a four-in-one infrastructure of "chip – data – model – standard"
Concept diagram of haptic co-processing chip technology

Where It Applies

Bringing haptic capability into more real-world tasks

We keep improving the product through real robotic tasks, adapting it to different application needs such as precision grasping, industrial operations and safe human–robot interaction.

Precision Grasping

Judging "has it grasped the object", "is the force appropriate" and "is the object slipping", providing contact feedback for dexterous hands and robotic arms.

Industrial Operations

For collaborative robots and industrial inspection, providing stable and reproducible contact and force judgement.

Safe Human–Robot Interaction

In scenarios where humans and robots share a workspace, detecting collisions and contact in time to inform safety strategies.

Concept diagram of the haptic application loop

Recognition & Endorsement

The attention and recognition our technology direction has received

Related chip and processor research results were published at VLSI 2025 and ISSCC 2026, two international conferences in integrated circuits, drawing international peer attention in the field of purpose-built edge computing for touch.

International Conference Results

VLSI 2025 / ISSCC 2026

We developed a software toolchain supporting automatic TFLite / ONNX deployment, an in-house data acquisition and multimodal data system, and the TouchBench benchmarking suite, forming a complete development loop.

Full-Stack Development Capability

Chip · Toolchain · Dataset

Incubated on the campus of The Hong Kong University of Science and Technology (Guangzhou), we carry out R&D and industrialization on the strength of the team's long-standing experience in sensor signal processing, AI chip design and mass production.

University Incubation

The Hong Kong University of Science and Technology (Guangzhou)

Technology & Product Questions

Frequently asked questions about technology and partnership

If you want to understand solution fit, integration or the partnership process, start with the notes here. For more specific questions, you are welcome to contact our team directly.

It means integrating haptic sensing fusion (SENSE), physical cognition computing (COMPUTE) and end-effector feedback control (CONTROL) into a single on-device co-processing chip. Compared with the "general-purpose compute chip plus external tactile sensor" approach common in the industry, this architecture offers advantages in integration level, latency and cost.

It can handle heterogeneous tactile signals such as pressure, force, temperature, vibration, slip and flexible electronic skin. Because robots today use many kinds of tactile sensors with differing interfaces and data formats, HapticSystem connects different tactile devices through a fairly general-purpose hardware and software platform; the exact fit needs to be assessed model by model.

Tactile signals are high-frequency, strongly time-ordered and contain the whole contact process; simply layering them onto a vision model can actually degrade system performance. Giving touch its own dedicated high-frequency processing path (dual ANN / SNN cores) is the key difference from comparable tactile sensor solutions. The quantitative results concerned are still to be confirmed; see the "Core Technical Metrics" section on the home page.

[To be confirmed: product status and availability] — please add the chip tape-out status, whether the SDK is available for trial, whether prototyping and evaluation are accepted, and the corresponding application process. This item is not yet confirmed and no commitment is made externally for now.

Submit your partnership enquiry through the Contact page or email us directly at info@hapticsys.com. We will arrange the right colleague to follow up: first a needs and fit assessment, then we agree on the form and timeline of the partnership.